Leap Solutions Asia takes part in Fintech Dynamic in Asia 2017

Leap Solutions Asia takes part in Fintech Dynamic in Asia

From 18 July 2017, Leap Solutions Asia Co., Ltd. (LSA) collaborated with TCC Technology Co., Ltd. to exhibit a booth at the Fintech Dynamic in Asia Forum at Casean CW Tower. LSA presented its Leap GIO Cloud platform with a special promotion to participants of the Thai Fintech Association. Many of the Association’s senior executives showed strong interest in the platform and asked for details on the cloud system during their visits to the booth.